IBM releases IoT electronic design platform in the cloud
June 9, 2015
Grazed from TheStack. Author: Alice MacGregor.
IBM has announced that it will be teaming up with silicon chip design platform provider SiCAD to offer a cloud-based solution – High Performance Services for Electronic Design Automation (EDA) – to help improve silicon design for smartphones, wearables and IoT devices.
The new set of tools will be available on demand across IBM’s SoftLayer infrastructure on a pay-as-you-go basis, allowing clients the flexibility to scale up or down depending on demand. According to Big Blue the new patented suite will deliver three main services: IBM Library Characterisation, to help the creation of abstract electrical and timing models for chip design; IBM Logic Verification, for the simulation of electronic systems and design languages; and IBM Spice, an electronic circuit simulator designed to measure quality and test chip behaviour…
IBM said that compute and networking deployment clusters will remain separate, in order to prevent clients sharing any infrastructure…
Read more from the source @ http://thestack.com/ibm-iot-electronic-design-platform-cloud-090615