Cloud Computing: Intel Metamaterials Breakthrough

January 19, 2016 Off By David
Object Storage

Grazed from EETimes. Author: R. Colin Johnson.

A metamaterial breakthrough has been funded by Intel at the Electromagnetic Compatibility (EMC) Lab at National Taiwan University here. By folding a metamaterial up into the third dimension (3D), Intel has funded a breakthrough in noise suppression–specifically quelling electro-magnetic interference (EMI) thus enabling easier electro-magnetic compatibility (EMC) of next-generation high-speed interfaces.

The Intel/NTU’s breakthrough is a single sub-millimeter sized component that replaces bulky traditional shielding by suppressing noise at each source by 20dB, according to Professor Tzong-Lin Wu, an IEEE Fellow and Director of the Graduate Institute of Communication Engineering (GICE) at NTU…

"Along with the vigorous development of cloud computing, it is of vital importance to enhance the bandwidth and efficiency of data centers and their communication devices for next-generation communication," Wu told EE Times in an exclusive interview. "New high-speed signal transmission design and high-frequency noise suppression technologies are key to enabling wider data bandwidth in cloud computing and other applications."…

Read more from the source @ http://www.eetimes.com/document.asp?doc_id=1328710